Eysa Lee

Email: eysa_lee @ brown.edu

CV - dblp - GScholar

I am a Postdoctoral Research Associate in the Data Science Institute (DSI) at Brown University under the mentorship of Anna Lysyanskaya.
I completed my PhD at Northeastern University in 2023, where I was advised by abhi shelat.

My research interests are in cryptography, and specifically signatures and multi-party computation.

Summer 2018, I visited Bar-Ilan University for a summer program on applied MPC and implementation.
Summer 2019, I worked with Peter Rindal as an intern at Visa Research in Palo Alto.
Summer 2022, I interned with an applied research team (FLARE) at JP Morgan in New York City.

Fall 2024: I'm planning to go on the job market! Wish me luck :)

In my spare time, I enjoy doodling, as evident by the Alice and Bob characters in my presentations.

Preprints

An Unstoppable Ideal Functionality for Signatures and a Modular Analysis of the Dolev-Strong Broadcast
Ran Cohen, Jack Doerner, Eysa Lee, Anna Lysyanskaya, and Lawrence Roy
[Paper]
Multi-Holder Anonymous Credentials from BBS Signatures
Andrea Flamini, Eysa Lee, and Anna Lysyanskaya
[Paper]

Conference Publications

Threshold ECDSA in Three Rounds
Jack Doerner, Yashvanth Kondi, Eysa Lee, and abhi shelat
IEEE S&P (Oakland) 2024
[Paper]
Threshold BBS+ Signatures for Distributed Anonymous Credential Issuance
Jack Doerner, Yashvanth Kondi, Eysa Lee, abhi shelat, and LaKyah Tyner
IEEE S&P (Oakland) 2023
[Paper]
Circuit Amortization Friendly Encodings and their Application to Statistically Secure Multiparty Computation
Anders Dalskov, Eysa Lee, Eduardo Soria-Vazquez
Asiacrypt 2020
[Paper] [Code] [Slides]
Multiparty Generation of an RSA Modulus
Megan Chen, Ran Cohen, Jack Doerner, Yashvanth Kondi, Eysa Lee, Schuyler Rosefield, and abhi shelat
CRYPTO 2020
[Paper]
Threshold ECDSA from ECDSA Assumptions: The Multiparty Case
Jack Doerner, Yashvanth Kondi, Eysa Lee, and abhi shelat
IEEE S&P (Oakland) 2019
[Paper] [Code]
Secure Two-party Threshold ECDSA from ECDSA Assumptions
Jack Doerner, Yashvanth Kondi, Eysa Lee, and abhi shelat
IEEE S&P (Oakland) 2018
[Paper] [Code] [Slides]
Signature Schemes with Randomized Verification
Cody Freitag, Rishab Goyal, Susan Hohenberger, Venkata Koppula, Eysa Lee, Tatsuaki Okamoto, Jordan Tran, and Brent Waters
ACNS 2017
[Paper]

Journal Publications

Multiparty Generation of an RSA Modulus
Megan Chen, Ran Cohen, Jack Doerner, Yashvanth Kondi, Eysa Lee, Schuyler Rosefield, and abhi shelat
Journal of Cryptology (full version)
[Paper]

Program Committees

IEEE EuroS&P 2025
FC 2025
IEEE S&P 2025 (PC and Research Ethics Committee)
CFAIL 2024 (PC Co-Chair)
CANS 2024